KeonBelt conveyor belt and transmission belt
in photovoltaic application
Cleaning and Texturing
In the process of wafer texturing, specific performance of friction must come with the conveyor belt to meet the need of grasping force on solar cells, to reach a safety conveying loop, extra specific technical design enables the optimal stability on the substance connecting surface. Belt working with the acid and alkaline solvent, was made of in extra corrosive resistance performance.
In the etching working process, it requires conveyor belt stand up in high temperature, chemical corrosion, static protection, high cleanness, as well as maintain immutably performance on stability, stretching resistance, deformation resistance. KeonBelt belts collected customer’s satisfaction on those aspects
Printing
When wafer cell is printing, conveyed in a precision line is the most significant property after all the requirements are met, it transfers with high precision, chemically corrosion resistance, static prevention, high cleanness, stable moving, high temperature environment working. One of the best options to be applied as such an all-round hexagon fighter.
Sorting
How does the KeonBelt belts play its role in wafer cell sorting process? KeonBelt dust free belt made of particulate in low shedding rate comes from mature technology and passed leveled test, on its smoothness and stainlessness, always in its role to convey low friction, high abrasion resistance, and static protection.
High precision and stability are the unvaried demand on wafer cell conveying work. Wafer cell temperature varies in a range in the sorting process, where KeonBelt belts displays stable performance in temperature difference.
String soldering of busbars
When comes to select and apply the timming belt in this process, it is a note that precise positioning requires eliminating sliding errors through gear matching, and avoiding the slipping risk of fixed friction transmission. High-level synchronous motion control needs to be coordinated with servo motors and vision systems to achieve precise synchronization of the welding head – transmission belt – manipulator. Moreover, the mechanical stress during the process should be minimized as much as possible to accommodate the fragility of the silicon wafer.
When conducting ribbon bonding, Currently the industry uses special Teflon conveyor belts that can withstand temperatures ranging from 200 to 300 degrees Celsius. Additionally, adding edge guiding or perforated vacuum suction functions must be equipped to avoid deviation. In the cutting process after ribbon bonding, the conveyor belt must be able to withstand high temperatures, be dust-proof, prevent particles from adhering to the solar cells, anti-static controlled within 10^6 – 10^9 Ω to prevent static adsorption of dust or damage to the solar cells. It also needs to be resistant to chemical corrosion and able to withstand the corrosion of cleaning agents such as soldering flux and alcohol.
| Item No. | Thickness | Elongation | Antistatic | Surface Material | Surface Friction | Max Elongation of Installation | Working Temperature | Application in S.C New Energy Technology | Application in LAPLACE Renewable Energy Technology |
|
|---|---|---|---|---|---|---|---|---|---|---|
 | FU-40BR FU-40BRD EL-14GA | 1.45 | 3% | Yes | Thermal Polyurthane | High friction | 8% | -20~+80℃ | S.C New Energy Technology; HJT Line Equipment HJT Texturing and Cleaning Equipment/SC-CSZT12000E-24F Amorphous Silicon Thin-Film Deposition/Plate-type PECVD TCO Film Deposition/RPD Series/RPD5500A TCO Film Deposition/PAR Equipment TCO Film Deposition/PVD Equipment S.C New Energy Technology; TOPCon Production Line Equipment Tunnel Oxide / Polysilicon Deposition/Tube-type LPCVD Tunnel Oxide / Polysilicon Deposition/Tube-type PE-poly Boron Diffusion/ Tube-type Low-Pressure Boron Diffusion Equipment Thin-Film Deposition/ Tube-type Two-in-One PECVD/ Aluminum Oxide Deposition/MAD Equipment | Core Thermal Process Equipment Low-Pressure Boron Diffusion Equipment/Prepares PN junction for N-type cells Low-Pressure Phosphorus Diffusion Equipment/Used for silicon wafer oxidation, phosphorus doping, and Poly phosphorus doping Low-Pressure Oxidation/Annealing Equipment/Suitable for thermal annealing and thermal activation processes for TOPCon and other cell structures |
| FU20BR FU-20BRD | 1.5 | 3% | Yes | Thermal Polyurthane | High friction | 8% | -20~+80℃ | S.C New Energy Technology; HJT Line Equipment HJT Texturing and Cleaning Equipment/SC-CSZT12000E-24F Amorphous Silicon Thin-Film Deposition/Plate-type PECVD TCO Film Deposition/RPD Series/RPD5500A TCO Film Deposition/PAR Equipment TCO Film Deposition/PVD Equipment S.C New Energy Technology; TOPCon Production Line Equipment Tunnel Oxide / Polysilicon Deposition/Tube-type LPCVD Tunnel Oxide / Polysilicon Deposition/Tube-type PE-poly Boron Diffusion/ Tube-type Low-Pressure Boron Diffusion Equipment Thin-Film Deposition/ Tube-type Two-in-One PECVD/ Aluminum Oxide Deposition/MAD Equipment | Core Thermal Process Equipment Low-Pressure Boron Diffusion Equipment/Prepares PN junction for N-type cells Low-Pressure Phosphorus Diffusion Equipment/Used for silicon wafer oxidation, phosphorus doping, and Poly phosphorus doping Low-Pressure Oxidation/Annealing Equipment/Suitable for thermal annealing and thermal activation processes for TOPCon and other cell structures |
 | FU-40B FU-40BD FU-12BR | 1.2 | 3% | Yes | Thermal Polyurthane | Middle friction | 8% | -30~+90℃ | S.C New Energy Technology; HJT Line Equipment HJT Texturing and Cleaning Equipment/SC-CSZT12000E-24F Amorphous Silicon Thin-Film Deposition/Plate-type PECVD TCO Film Deposition/RPD Series/RPD5500A TCO Film Deposition/PAR Equipment TCO Film Deposition/PVD Equipment S.C New Energy Technology; TOPCon Production Line Equipment Tunnel Oxide / Polysilicon Deposition/Tube-type LPCVD Tunnel Oxide / Polysilicon Deposition/Tube-type PE-poly Boron Diffusion/ Tube-type Low-Pressure Boron Diffusion Equipment Thin-Film Deposition/ Tube-type Two-in-One PECVD/ Aluminum Oxide Deposition/MAD Equipment | Core Thermal Process Equipment Low-Pressure Boron Diffusion Equipment/Prepares PN junction for N-type cells Low-Pressure Phosphorus Diffusion Equipment/Used for silicon wafer oxidation, phosphorus doping, and Poly phosphorus doping Low-Pressure Oxidation/Annealing Equipment/Suitable for thermal annealing and thermal activation processes for TOPCon and other cell structures |
| FU60G | 1.5 | 2% | Yes | Thermal Polyurthane | Low friction | 5% | -20~+60℃ | S.C New Energy Technology; HJT Line Equipment HJT Texturing and Cleaning Equipment/SC-CSZT12000E-24F Amorphous Silicon Thin-Film Deposition/Plate-type PECVD TCO Film Deposition/RPD Series/RPD5500A TCO Film Deposition/PAR Equipment TCO Film Deposition/PVD Equipment S.C New Energy Technology; TOPCon Production Line Equipment Tunnel Oxide / Polysilicon Deposition/Tube-type LPCVD Tunnel Oxide / Polysilicon Deposition/Tube-type PE-poly Boron Diffusion/ Tube-type Low-Pressure Boron Diffusion Equipment Thin-Film Deposition/ Tube-type Two-in-One PECVD/ Aluminum Oxide Deposition/MAD Equipment | Core Thermal Process Equipment Low-Pressure Boron Diffusion Equipment/Prepares PN junction for N-type cells Low-Pressure Phosphorus Diffusion Equipment/Used for silicon wafer oxidation, phosphorus doping, and Poly phosphorus doping Low-Pressure Oxidation/Annealing Equipment/Suitable for thermal annealing and thermal activation processes for TOPCon and other cell structures |
 | FU09R | 1.3 | 4% | Yes | Thermal Polyurthane | Middle friction | 8% | -20~+60℃ | S.C New Energy Technology; HJT Line Equipment HJT Texturing and Cleaning Equipment/SC-CSZT12000E-24F Amorphous Silicon Thin-Film Deposition/Plate-type PECVD TCO Film Deposition/RPD Series/RPD5500A TCO Film Deposition/PAR Equipment TCO Film Deposition/PVD Equipment S.C New Energy Technology; TOPCon Production Line Equipment Tunnel Oxide / Polysilicon Deposition/Tube-type LPCVD Tunnel Oxide / Polysilicon Deposition/Tube-type PE-poly Boron Diffusion/ Tube-type Low-Pressure Boron Diffusion Equipment Thin-Film Deposition/ Tube-type Two-in-One PECVD/ Aluminum Oxide Deposition/MAD Equipment | Core Thermal Process Equipment Low-Pressure Boron Diffusion Equipment/Prepares PN junction for N-type cells Low-Pressure Phosphorus Diffusion Equipment/Used for silicon wafer oxidation, phosphorus doping, and Poly phosphorus doping Low-Pressure Oxidation/Annealing Equipment/Suitable for thermal annealing and thermal activation processes for TOPCon and other cell structures |
 | TA11G | Thermal Polyurthane | S.C New Energy Technology; HJT Line Equipment HJT Texturing and Cleaning Equipment/SC-CSZT12000E-24F Amorphous Silicon Thin-Film Deposition/Plate-type PECVD TCO Film Deposition/RPD Series/RPD5500A TCO Film Deposition/PAR Equipment TCO Film Deposition/PVD Equipment S.C New Energy Technology; TOPCon Production Line Equipment Tunnel Oxide / Polysilicon Deposition/Tube-type LPCVD Tunnel Oxide / Polysilicon Deposition/Tube-type PE-poly Boron Diffusion/ Tube-type Low-Pressure Boron Diffusion Equipment Thin-Film Deposition/ Tube-type Two-in-One PECVD/ Aluminum Oxide Deposition/MAD Equipment | Core Thermal Process Equipment Low-Pressure Boron Diffusion Equipment/Prepares PN junction for N-type cells Low-Pressure Phosphorus Diffusion Equipment/Used for silicon wafer oxidation, phosphorus doping, and Poly phosphorus doping Low-Pressure Oxidation/Annealing Equipment/Suitable for thermal annealing and thermal activation processes for TOPCon and other cell structures |
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  • SMT-UU12B Replacement Transmission Belt | TFG2E | 1.2 | 5% | Yes | Thermal Polyurthane | Middle friction | 8% | -20~+80℃ | S.C New Energy Technology; HJT Line Equipment HJT Texturing and Cleaning Equipment/SC-CSZT12000E-24F Amorphous Silicon Thin-Film Deposition/Plate-type PECVD TCO Film Deposition/RPD Series/RPD5500A TCO Film Deposition/PAR Equipment TCO Film Deposition/PVD Equipment S.C New Energy Technology; TOPCon Production Line Equipment Tunnel Oxide / Polysilicon Deposition/Tube-type LPCVD Tunnel Oxide / Polysilicon Deposition/Tube-type PE-poly Boron Diffusion/ Tube-type Low-Pressure Boron Diffusion Equipment Thin-Film Deposition/ Tube-type Two-in-One PECVD/ Aluminum Oxide Deposition/MAD Equipment | Core Thermal Process Equipment Low-Pressure Boron Diffusion Equipment/Prepares PN junction for N-type cells Low-Pressure Phosphorus Diffusion Equipment/Used for silicon wafer oxidation, phosphorus doping, and Poly phosphorus doping Low-Pressure Oxidation/Annealing Equipment/Suitable for thermal annealing and thermal activation processes for TOPCon and other cell structures |
• SMT-UU12B Replacement Transmission Belt | TA15GTR | 1.5 | 3% | Yes | Thermal Polyurthane | Middle friction | 6% | -20~+80℃ | S.C New Energy Technology; HJT Line Equipment HJT Texturing and Cleaning Equipment/SC-CSZT12000E-24F Amorphous Silicon Thin-Film Deposition/Plate-type PECVD TCO Film Deposition/RPD Series/RPD5500A TCO Film Deposition/PAR Equipment TCO Film Deposition/PVD Equipment S.C New Energy Technology; TOPCon Production Line Equipment Tunnel Oxide / Polysilicon Deposition/Tube-type LPCVD Tunnel Oxide / Polysilicon Deposition/Tube-type PE-poly Boron Diffusion/ Tube-type Low-Pressure Boron Diffusion Equipment Thin-Film Deposition/ Tube-type Two-in-One PECVD/ Aluminum Oxide Deposition/MAD Equipment | Core Thermal Process Equipment Low-Pressure Boron Diffusion Equipment/Prepares PN junction for N-type cells Low-Pressure Phosphorus Diffusion Equipment/Used for silicon wafer oxidation, phosphorus doping, and Poly phosphorus doping Low-Pressure Oxidation/Annealing Equipment/Suitable for thermal annealing and thermal activation processes for TOPCon and other cell structures |
| More type and optionn please consult us. | ||||||||||