In solar cell manufacturing, the etching process (including Saw Damage Etching and Texturing), is a chemically aggressive and high-precision stage. The wafers are at their thinnest and most vulnerable during this transition, the conveyance system (the belts and rollers) faces unique challenges.

Currently those etching process are equipped by

BatchTex, BatchEtch, InEtchSide™ , BatchPolyClean™ by RENA Technologie.

BatchTex® series: Used for monocrystalline silicon alkaline texturing, it is one of the most commonly used solutions in the industry.

BatchEtch® series: Used for batch wet etching processes, it can flexibly handle both alkaline and acidic processes.

InEtchSide™ series: The latest InEtchSide 4+ model has been used for etching production of TOPCon cells.

BatchPolyClean™ series: Specifically designed for polysilicon removal and cleaning in TOPCon cell manufacturing.

Singulus (Germany): A representative of high-end technology, particularly in the HJT field, known for high performance and low breakage rate.

In Chinese intelligent automaton enterprises on etching and texturing field, our clients mainly applied S.C Linton, Kzon, Kelongwei, Shanghai SNA.

S.C for the comprehensive wet processing equipment (texturing, polishing, etching), is taken as the industry giant with leading market share.

Linton is covering the entire photovoltaic industry chain.

Kzone (Suzhou JZ Equipment Technology) brings its Alkaline polishing etching, TOPCon wet processing equipment with technology breakthrough type breaking foreign monopolies.

Kelongwei (Guangdong Kelongwei Machinery Equipment) takes its wet cleaning and texturing equipment strong expands its users capacity.

 

When KeonBelt deals with those brands’ conveyance solutions daily with the clients.

We have here made a conclusion,
the most common issues that occur in the etching process conveyance:

1. Chemical Corrosion & Material Degradation
   The etching process uses highly corrosive chemicals—typically Potassium Hydroxide (KOH) for alkaline etching or Hydrofluoric/Nitric Acid (HF/HNO₃) for acidic etching.
   The Issue: Standard rubber or low-grade plastic belts react with these chemicals, leading to “swelling,” hardening, or surface cracking.
   Result: This causes belt fracture or “joint cracking,” leading to sudden line stoppages.
2. “Black Print” & Particle Contamination
   As conveyance belts wear down due to chemical exposure and friction, they shed microscopic particles.
   The Issue: Abrasion of the belt surface creates “powder shedding.”
   Result: These particles stick to the wet, etched surface of the wafer, causing shading or contamination that interferes with subsequent diffusion and metallization steps, ultimately lowering cell efficiency.
3.  Wafer Slipping & Skewed Alignment
   Etching lines are “wet” environments. The presence of chemical solutions and deionized (DI) water creates a lubrication effect between the wafer and the belt.
   The Issue: Loss of friction (surface polishing) on the belt.
   Result: Wafers “hydroplane” or slip, leading to deviation and skewed alignment. When wafers are not perfectly aligned, they can crash into the edges of the wet bench or be misfed into the next station, causing massive breakage.
4.  Micro-Cracking from Mechanical Impact
   Etched wafers are significantly thinner (often 130μm or less) and have had their “saw damage” layer removed, making them extremely brittle.
   The Issue: Hard or vibrating conveyance belts/rollers apply uneven pressure or “chatter” against the wafer.
   Result: Invisible micro-cracks form at the edges. These cracks may not break the wafer immediately but will expand during the high-heat diffusion process, leading to “cell explosions” in the furnace.
5. Hydrophobic/Hydrophilic Tension Issues
   After etching, the surface energy of the silicon wafer changes (it becomes very “thirsty” or reactive).
   The Issue: If the belt material has high surface tension or is not “clean-room” compatible, it can cause suction or “label sticking.”
   Result: The wafer sticks to the belt during the transfer from the wet tank to the dryer, causing the wafer to be pulled under the rollers or snapped during the hand-off.

In the final, we have consolidate an cell production belts maintenance table daily record, to be used for plant management. It is based on our working experience on the practical experience. You can freely contact our representatives to get it.